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Revision 1.02

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AS1302

Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s

10 Package Drawings and Markings

The device is available in a TDFN (3x3x0.8mm) 10-pin and WL-CSP 8-bumps package.

Figure 37. TDFN (3x3x0.8mm) 10-pin Package Diagram

Note:

1. Figure 37 is shown for illustration only.

2. N is the total number of terminals.

3. All dimensions are in millimeters, angle is in degrees.

4. Dimensioning and tolerancing conform to ASME Y14.5M-1994.

Table 6. TDFN (3x3x0.8mm) 10-pin Package Dimensions

Symbol

Min

Typ

Max

Symbol

Min

Typ

Max

A

0.70

0.75

0.80

D BSC

3.00

A1

0.00

0.02

0.05

E BSC

3.00

A3

0.20 REF

D2

2.20

2.70

L1

0.03

0.15

E2

1.40

1.75

L2

0.13

L

0.30

0.40

0.50

aaa

0.15

θ

0º

bbb

0.10

k

0.20

ccc

0.10

b

0.18

0.25

0.30

ddd

0.05

e

0.50

eee

0.08

N

10

ggg

0.10

ND

5

SEE

DETAIL B

PIN 1 INDEX AREA

(D/2 xE/2)

BTM VIEW

N-1

N

bbb

ddd

D2

D2/2

b

(D/2 xE/2)

2x

TOP VIEW

aaa C

PIN 1 INDEX AREA

D

ccc C

SIDE VIEW

(ND-1) X e

e

0.08 C

B

L

C A B

C

SEATING

PLANE

K

C

DETAIL B

Datum A or B

Terminal Tip

e

ODD TERMINAL SIDE