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LTC2471CDDPBF Datasheet(PDF) 14 Page - Linear Technology |
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LTC2471CDDPBF Datasheet(HTML) 14 Page - Linear Technology |
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14 / 20 page ![]() LTC2471/LTC2473 14 24713f APPLICATIONS INFORMATION PRESERVING THE CONVERTER ACCURACY The LTC2471/LTC2473 are designed to minimize the conver- sion result’s sensitivity to device decoupling, PCB layout, anti-aliasing circuits, line and frequency perturbations. Nevertheless,inordertopreservethehighaccuracycapabil- ity of this part, some simple precautions are desirable. Digital Signal Levels Due to the nature of CMOS logic, it is advisable to keep input digital signals near GND or VCC. Voltages in the range of 0.5V to VCC – 0.5V may result in additional current leakage from the part. Undershoot and overshoot should also be minimized, particularly while the chip is converting. It is thus beneficial to keep edge rates of about 10ns and limit overshoot and undershoot to less than 0.3V. Driving VCC and GND In relation to the VCC and GND pins, the LTC2471/LTC2473 combines internal high frequency decoupling with damping elements, which reduce the ADC performance sensitivity to PCB layout and external components. Nevertheless, the very high accuracy of this converter is best pre- served by careful low and high frequency power supply decoupling. A 0.1μF, high quality, ceramic capacitor in parallel with a 10μF low ESR ceramic capacitor should be connected between the VCC and GND pins, as close as possible to the package. The 0.1μF capacitor should be placed closest to the ADC package. It is also desirable to avoid any via in the circuit path, starting from the converter VCC pin, passing through these two decoupling capacitors, and returning to the converter GND pin. The area encompassed by this circuit path, as well as the path length, should be minimized. As shown in Figure 11, REF– is used as the negative reference voltage input to the ADC. This pin can be tied directly to ground or Kelvin sensed to sensor ground. In the case where REF– is used as a sense input, it should be bypassed to ground with a 0.1μF ceramic capacitor in parallel with a 10μF low ESR ceramic capacitor. Very low impedance ground and power planes, and star connections at both VCC and GND pins, are preferable. The VCC pin should have two distinct connections: the first to the decoupling capacitors described above, and the second to the ground return for the power supply voltage source. REFOUT and COMP The on chip 1.25V reference is internally tied to the converter’s reference input and is output to the REFOUT pin. A 0.1μF capacitor should be placed on the REFOUT pin. It is possible to reduce this capacitor, but the transition noise increases (see Figure 4). A 0.1μF capacitor should also be placed on the COMP pin. This pin is tied to an internal point in the reference and is used for stability. In order for the reference to remain stable, the capacitor placed on the COMP pin must be greater than or equal to the capacitor tied to the REFOUT pin. The REFOUT pin cannot be overridden by an external voltage. Depending on the size of the capacitors tied to the REFOUT and COMP pins, the internal reference has a corresponding start up time. This start up time is typically 12ms when Figure 11. LTC2471/LTC2473 Analog Input/Reference Equivalent Circuit RSW 15k (TYP) ILEAK ILEAK VCC VCC VCC VCC CEQ 0.35pF (TYP) IN+ (LTC2473) IN– (LTC2473) IN (LTC2471) REF– REFOUT INTERNAL REFERENCE 24713 F11 RSW 15k (TYP) ILEAK ILEAK RSW 15k (TYP) ILEAK ILEAK RSW 15k (TYP) ILEAK ILEAK |
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