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LTC2471CDDPBF Datasheet(PDF) 14 Page - Linear Technology

Part # LTC2471CDDPBF
Description  Selectable 250sps/1ksps, 16-Bit I2C ?誇 ADCs with 10ppm/째C Max Precision Reference
PDF  20 Pages
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTC2471CDDPBF Datasheet(HTML) 14 Page - Linear Technology

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LTC2471/LTC2473
14
24713f
APPLICATIONS INFORMATION
PRESERVING THE CONVERTER ACCURACY
The LTC2471/LTC2473 are designed to minimize the conver-
sion result’s sensitivity to device decoupling, PCB layout,
anti-aliasing circuits, line and frequency perturbations.
Nevertheless,inordertopreservethehighaccuracycapabil-
ity of this part, some simple precautions are desirable.
Digital Signal Levels
Due to the nature of CMOS logic, it is advisable to keep input
digital signals near GND or VCC. Voltages in the range of
0.5V to VCC – 0.5V may result in additional current leakage
from the part. Undershoot and overshoot should also be
minimized, particularly while the chip is converting. It is
thus beneficial to keep edge rates of about 10ns and limit
overshoot and undershoot to less than 0.3V.
Driving VCC and GND
In relation to the VCC and GND pins, the LTC2471/LTC2473
combines internal high frequency decoupling with damping
elements, which reduce the ADC performance sensitivity
to PCB layout and external components. Nevertheless,
the very high accuracy of this converter is best pre-
served by careful low and high frequency power supply
decoupling.
A 0.1μF, high quality, ceramic capacitor in parallel with
a 10μF low ESR ceramic capacitor should be connected
between the VCC and GND pins, as close as possible to the
package. The 0.1μF capacitor should be placed closest
to the ADC package. It is also desirable to avoid any via
in the circuit path, starting from the converter VCC pin,
passing through these two decoupling capacitors, and
returning to the converter GND pin. The area encompassed
by this circuit path, as well as the path length, should be
minimized.
As shown in Figure 11, REF– is used as the negative
reference voltage input to the ADC. This pin can be tied
directly to ground or Kelvin sensed to sensor ground. In
the case where REF– is used as a sense input, it should
be bypassed to ground with a 0.1μF ceramic capacitor in
parallel with a 10μF low ESR ceramic capacitor.
Very low impedance ground and power planes, and star
connections at both VCC and GND pins, are preferable.
The VCC pin should have two distinct connections: the
first to the decoupling capacitors described above, and
the second to the ground return for the power supply
voltage source.
REFOUT and COMP
The on chip 1.25V reference is internally tied to the
converter’s reference input and is output to the REFOUT
pin. A 0.1μF capacitor should be placed on the REFOUT
pin. It is possible to reduce this capacitor, but the transition
noise increases (see Figure 4). A 0.1μF capacitor should
also be placed on the COMP pin. This pin is tied to an
internal point in the reference and is used for stability.
In order for the reference to remain stable, the capacitor
placed on the COMP pin must be greater than or equal
to the capacitor tied to the REFOUT pin. The REFOUT pin
cannot be overridden by an external voltage.
Depending on the size of the capacitors tied to the REFOUT
and COMP pins, the internal reference has a corresponding
start up time. This start up time is typically 12ms when
Figure 11. LTC2471/LTC2473 Analog Input/Reference
Equivalent Circuit
RSW
15k
(TYP)
ILEAK
ILEAK
VCC
VCC
VCC
VCC
CEQ
0.35pF
(TYP)
IN+
(LTC2473)
IN–
(LTC2473)
IN
(LTC2471)
REF–
REFOUT
INTERNAL
REFERENCE
24713 F11
RSW
15k
(TYP)
ILEAK
ILEAK
RSW
15k
(TYP)
ILEAK
ILEAK
RSW
15k
(TYP)
ILEAK
ILEAK



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