Surface Mount PPTC

FSMD1206 Series

THERMAL DERATING CURVE

PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS

TYPICAL TIME-TO-TRIP AT 23°C

The dimension in the table below provide the recommended pad layout for each FSMD1206 device

NOTE: All Specification subject to change without notice.

SOLDER REFLOW

1.9

1.0

1.0

2.0

Thermal Derating Curve, FSMD1206 Series

0%

50%

100%

150%

200%

-40

-20

0

20

40

60

80

Ambient Tempera ture (C)

A

B

C D

0.001

0.01

0.1

1

10

100

Fault current (A)

Z

0.1

1

10

100

NOMINAL PAD DIMENSIONS (MILLIMETERS)

RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com

RoHS

ü

Z = FSMD005-1206

A = FSMD010-1206

B = FSMD020-1206

C = FSMD035-1206

D = FSMD050-1206

Solder Reflow

Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.

1. Recommended reflow methods; IR, vapor phase oven, hot air oven.

2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)

3. Recommended maximum paste thickness is 0.25mm.

4. Devices can be cleaned by using standard industry methods and solvents.

5. Storage Environment: <30°C / 60%RH

Caution:

If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.

Rework:

Use standard industry practices.

C5ED01

REV 2007.8.14

260 °C

217 °C

200 °C

150 °C

25 °C

f

60 to 180 Seconds

60 to 150 Seconds

Ramp-up

3°C/Second Max

20 to 40 Seconds

Ramp-down

6°C/Second Max

Preheat