DYNAMIC CHARACTERISTICS

ARF1511

Symbol

C

iss

C

oss

C

rss

t

d(on)

t

r

t

d(off)

t

f

E

AR

E

AS

Characteristic

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Turn-on Delay Time

Rise Time

Turn-off Delay Time

Fall Time

Test Conditions

V

V

f = 1 MHz

V

V

I

R

MIN

TYP

MAX

1200

1400

150

200

60

90

7

6

20

4.4

10

450

UNIT

pF

ns

mJ

FUNCTIONAL CHARACTERISTICS

Symbol

G

PS

η

Ψ

Test Conditions

f = 40.7 MHz

V

V

P

No Degradation in Output Power

Characteristic

Common Source Amplifier Power Gain

Drain Efficiency

Electrical Ruggedness VSWR 6:1

MIN

TYP

MAX

13

15

75

UNIT

dB

%

1 Pulse Test: Pulse width < 380 μS, Duty Cycle < 2%.

2 Repetitive Rating: Pulse width limited by maximum junction

temperature.

3 Starting T

HAZARDOUS MATERIAL

WARNING

The ceramic portion of the

device

between leads and mounting surface

is beryllium oxide, BeO.

Beryllium

oxide dust is toxic when inhaled.

Care must be taken during handling

and mounting to avoid damage to

this area. These devices must never

be thrown away with general industri-

al or domestic waste.

D1

S1D2

G1

G2

S2

D3

G3

S3D4

G4

S4

ARF 1511

Clamp

Heat Sink

ARF1511

1.065"

27.05 mm

1.065"

27.05 mm

.100

.100

.300

.300

.100

.175

.075

.100

.100

.175

.075

D1

S1D2

G1

G2

S2

D3

G3

S3D4

G4

S4

.005

.045

.254

Microsemi reserves the right to change, without notice, the specifications and information contained herein.

Thermal Considerations and Package Mounting:

The rated 1500W power dissipation is only available

when the package mounting surface is at 25°C and the

junction temperature is 175°C. The thermal resis-

tance between junctions and case mounting surface

is 0.10°C/W. When installed, an additional thermal

impedance of 0.06°C/W between the package base and

the mounting surface is smooth and flat. Thermal joint

compound must be used to reduce the effects of small

surface irregularities. The heatsink should incorporate a

copper heat spreader to obtain best results.

The package is designed to be clamped to a heatsink. A

clamped joint maintains the required mounting pressure

while allowing for thermal expansion of both the device

and the heat sink. A simple clamp, and two 6-32 (M3.5)

screws can provide the minimum 125 lb. required

mounting force. T=4-6 in-lb. Please refer to App Note

1802 "Mounting Instructions for Flangeless Packages."