ADP172ACBZ-1.2-R7 datasheet(15/20 Pages) AD

15 / 20 page

ADP172

Rev. 0 | Page 15 of 20

100

120

140

0.3

0.5

0.7

0.9

1.1

1.3

1.5

1.7

1.9

2.1

2.3

2.5

VIN – VOUT (V)

ILOAD = 300mA

TJ MAX

ILOAD = 1mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 200mA

ILOAD = 10mA

Figure 31. 100 mm2 of PCB Copper, TA = 25°C

100

120

140

0.3

0.5

0.7

0.9

1.1

1.3

1.5

1.7

1.9

2.1

2.3

2.5

VIN – VOUT (V)

ILOAD = 300mA

TJ MAX

ILOAD = 1mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 200mA

ILOAD = 10mA

Figure 32. 0 mm2 of PCB Copper, TA = 25°C

100

120

140

0.3

0.5

0.7

0.9

1.1

1.3

1.5

1.7

1.9

2.1

2.3

2.5

VIN – VOUT (V)

ILOAD = 300mA

TJ MAX

ILOAD = 1mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 200mA

ILOAD = 10mA

Figure 33. 500 mm2 of PCB Copper, TA = 50°C

100

120

140

0.3

0.5

0.7

0.9

1.1

1.3

1.5

1.7

1.9

2.1

2.3

2.5

VIN – VOUT (V)

ILOAD = 300mA

TJ MAX

ILOAD = 1mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 200mA

ILOAD = 10mA

Figure 34. 100 mm2 of PCB Copper, TA = 50°C

100

120

140

0.3

0.5

0.7

0.9

1.1

1.3

1.5

1.7

1.9

2.1

2.3

2.5

VIN – VOUT (V)

ILOAD = 300mA

TJ MAX

ILOAD = 1mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 200mA

ILOAD = 10mA

Figure 35. 0 mm2 of PCB Copper, TA = 50°C

In cases where board temperature is known, use the thermal

characterization parameter, ΨJB, to estimate the junction tem-

perature rise (see Figure 36). Maximum junction temperature

(TJ) is calculated from the board temperature (TB) and power

dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

(5)

The typical value of ΨJB is 58°C/W for the 4-Ball WLCSP package.

100

120

140

0.3

0.5

0.7

0.9

1.1

1.3

1.5

1.7

1.9

2.1

2.3

2.5

VIN – VOUT (V)

ILOAD = 300mA

TJ MAX

ILOAD = 1mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 200mA

ILOAD = 10mA

Figure 36. TA = 85°C

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