POWERMITE 1™ SURFACE MOUNT

1 AMP 20 and 40 V SCHOTTKY RECTIFIERS

S C O T TS DALE DIVISION

UPS5817e3 and UPS5819e3

DESCRIPTION

APPEARANCE

The UPS5817e3 and UPS5819e3 offer a small and powerful surface mount

package that is RoHS compliant for a 1 Amp rated Schottky. These ratings

are found only in much larger packages. They are ideal for surface mount

applications that operate at high frequencies with their “hot carrier” features

that provide extremely fast switching. The very low thermal resistance of the

patented Powermite 1™ package design with a full metallic bottom and

cooler operating junction temperatures for minimal reverse leakage currents

and lower power loss. It is also ideal for automatic insertion equipment.

DO-216

Powermite 1™

IMPORTANT:

For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

FEATURES

APPLICATIONS / BENEFITS

•

Low profile DO-216 package (<1.1 mm)

•

RoHS compliant with e3 suffix part number

•

Small footprint area of 8.45 mm

2

•

Plastic package has Underwriters Laboratory

Flammability classification 94V-0

•

Unique locking tab on bottom acts as integral efficient

heat path to heat sink (mounting substrate)

•

Metal to silicon rectifier, majority carrier conduction

•

High current capability with low forward voltage

•

Guard-ring-die construction for transient protection

•

and minimal reverse recovery voltage

•

Elimination of reverse-recovery oscillations to

reduce need for EMI filtering

•

For use in high-frequency switching power supplies,

inverters, free wheeling, charge pump circuits and

polarity protection applications

•

Lower forward power loss and high efficiency

•

Low inductive parasitics (<2nH) for minimal Ldi/dt

effects

•

Robust package configuration for pick-and-place

handling

•

Full-metallic bottom eliminates flux entrapment

•

Small foot print with 0.100 x 0.160 inches (see

mounting pad details on last page)

MAXIMUM RATINGS

MECHANICAL AND PACKAGING

•

•

•

Amp

•

waveform superimposed on rated load (JEDEC

Method): 50 Amps

•

Thermal resistance junction to case (bottom): 10

•

using 1 oz Copper and recommended mounting pad

size (see pad layout next page)

•

Solder temperatures: 260

•

Terminals: Copper with annealed matte-Tin plating

for RoHS compliance solderable per MIL-STD-750

method 2026 (consult factory for Tin-Lead plating

•

Polarity: Backside is cathode

•

Marking: UPS5817e3 marked with S17•

and UPS5819e3 marked with S19•

•

Molded epoxy package meets UL94V-0

•

Weight: 0.016 grams (approximate)

•

Tape & Reel option: 12 mm tape per EIA-481-B

3000 units on 7 inch reel and 12,000 on 13” reel

(add TR7 or TR13 respectively to part number)

•

See package dimensions on last page

Microsemi

Scottsdale Division

Page 1

Copyright

© 2007

10-15-2007 REV D

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503