SS8061G datasheet(2/6 Pages) SSC

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SS8061G

1/21/2005 Rev.2.01

ABSOLUTE MAXIMUM RATINGS

OPERATING CONDITIONS (note 1)

Input Voltage……………………………………………..7V

VEN Voltage…………..…………………………..VIN+0.3V

Power Dissipation Internally Limited

(Note 2)

Maximum Junction Temperature…………………150°C

Storage Temperature Range……..-65°C

≤TJ ≤ +150°C

Reflow Temperature (soldering, 10sec)……..….260°C

Thermal Resistance Junction to Ambient…..…177°C/W

Thermal Resistance Junction to Case………..…52°C/W

ESD Rating (Human Body Model)…………..………2kV

Input Voltage………………………………….2.2V ~5.5V

Temperature Range………….………-40°C

≤TA ≤ +85°C

ELECTRICAL CHARACTERISTICS

VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7µF, COUT =10µF, TA = TJ = 25°C unless otherwise specified (Note 3)

PARAMETER

SYMBOL

CONDITION

MIN

TYP

MAX

UNIT

Supply Voltage

VIN

2.2

---

5.5

Output Voltage

VIN=VO +0.7V, IO=10mA

-2

Line Regulation

VO+0.7V < VIN < 5.5V, IO=10mA

---

0.2

Load Regulation

10mA < IO < 1A

---

0.8

VIN=3.3V,VEN=VIN

---

1.7

2.5

Quiescent Current

VIN=3.3V,VEN=0V

---

µA

Ripple Rejection

fi=120Hz, 1VP-P, IO=100mA

---

Dropout Voltage

IO=1A

---

0.4

0.6

Short Circuit Current

---

0.8

---

Over Temperature

---

150

---

°C

VEN Voltage High

VENH

Output Active

1.6

---

VEN Voltage Low

VENL

Output Disabled

---

0.4

VEN Bias Current Low

IENL

VEN=0.4V

---

µA

ADJ Reference Voltage

VREF

VIN=2.2V, VADJ=VOUT, IO=10mA

1.188

1.2

1.212

ADJ Pin Threshold

---

0.2

---

Note 1:

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions

are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed

specifications and test conditions see the Electrical Characteristics.

Note2:

The maximum power dissipation is a function of the maximum junction temperature, TJmax; total thermal resis-

tance,

θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature

is (Tjmax-TA) / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into

thermal shutdown.

Note3:

Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

Note4:

The type of output capacitor should be tantalum or aluminum.

Definitions

Dropout Voltage

The input/output Voltage differential at which the regula-

tor output no longer maintains regulation against further

reductions in input voltage. Measured when the output

drops 2% below its nominal value, dropout voltage is

affected by junction temperature, load current and mini-

mum input supply requirements.

Line Regulation

The change in output voltage for a change in input voltage.

The measurement is made under conditions of low dissi-

pation or by using pulse techniques such that average chip

temperature is not significantly affected.

Load Regulation

The change in output voltage for a change in load cur-

rent at constant chip temperature. The measurement is

made under conditions of low dissipation or by using

pulse techniques such that average chip temperature is

not significantly affected.

Maximum Power Dissipation

The maximum total device dissipation for which the

regulator will operate within specifications.

Quiescent Bias Current

Current which is used to operate the regulator chip and is

not delivered to the load.

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