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HAL401 Datasheet(PDF) 5 Page - Micronas |
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HAL401 Datasheet(HTML) 5 Page - Micronas |
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5 / 20 page  HAL401 DATA SHEET 5 Micronas 1.5. Solderability and Welding Soldering During soldering reflow processing and manual rework- ing, a component body temperature of 260 °C should not be exceeded. Welding Device terminals should be compatible with laser and re- sistance welding. Please note that the success of the welding process is subject to different welding parame- ters which will vary according to the welding technique used. A very close control of the welding parameters is absolutely necessary in order to reach satisfying results. Micronas, therefore, does not give any implied or ex- press warranty as to the ability to weld the component. OUT1 GND 2 4 1 VDD Fig. 1–1: Pin configuration OUT2 3 |
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