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MCS0402AT Datasheet(PDF) 4 Page - Vishay Siliconix

Part # MCS0402AT
Description  Professional Thin Film Chip Resistor Superior Moisture Resistivity
PDF  11 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

MCS0402AT Datasheet(HTML) 4 Page - Vishay Siliconix

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MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
Professional Thin Film Chip Resistor
Superior Moisture Resistivity
Vishay Beyschlag
Document Number: 28760
For technical questions, contact: thinfilmchip@vishay.com
www.vishay.com
Revision: 07-Dec-09
4
DIMENSIONS
SOLDER PAD DIMENSIONS
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain the
reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on boardmaterials.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.
Please note however that applications for “power operation mode” or “advanced temperature mode” require special considerations for the
design of solder pads and adjacent conductor areas.
DIMENSIONS AND MASS
TYPE
H
(mm)
L
(mm)
W
(mm)
WT
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
MCS 0402 AT
0.32 ± 0.05
1.0 ± 0.05
0.5 ± 0.05
> 75 % of W
0.2 + 0.1/- 0.15
0.2 ± 0.1
0.6
MCT 0603 AT
0.45 + 0.1/- 0.05
1.55 ± 0.05
0.85 ± 0.1
> 75 % of W
0.3 + 0.15/- 0.2
0.3 + 0.15/- 0.2
1.9
MCU 0805 AT
0.52 ± 0.1
2.0 ± 0.1
1.25 ± 0.15
> 75 % of W
0.4 + 0.1/- 0.2
0.4 + 0.1/- 0.2
4.6
MCA 1206 AT
0.55 ± 0.1
3.2 + 0.1/- 0.2
1.6 ± 0.15
> 75 % of W
0.5 ± 0.25
0.5 ± 0.25
9.2
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE
WAVE SOLDERING
REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCS 0402 AT
-
-
-
-
0.35
0.55
0.55
1.45
MCT 0603 AT
0.55
1.10
1.10
2.75
0.65
0.70
0.95
2.05
MCU 0805 AT
0.80
1.25
1.50
3.30
0.90
0.90
1.40
2.70
MCA 1206 AT
1.40
1.50
1.90
4.40
1.50
1.15
1.75
3.80
T
2
T
1
L
H
W
W
T
G
X
Y
Z



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