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P89LPC9211FDH Datasheet(PDF) 68 Page - NXP Semiconductors |
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P89LPC9211FDH Datasheet(HTML) 68 Page - NXP Semiconductors |
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68 / 74 page ![]() P89LPC92X1_1 © NXP B.V. 2009. All rights reserved. Preliminary data sheet Rev. 01 — 16 April 2009 68 of 74 NXP Semiconductors P89LPC9201/9211/922A1/9241/9251 8-bit microcontroller with 8-bit ADC 13. Package outline Fig 37. TSSOP20 package outline (SOT360-1) UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT360-1 MO-153 99-12-27 03-02-19 w M b p D Z e 0.25 110 20 11 pin 1 index θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 A max. 1.1 |
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