PIC18F2610-ESLASHML datasheet(5/376 Pages) MICROCHIP

5 / 376 page

DS39636D-page 7

PIC18F2X1X/4X1X

Table of Contents

1.0

Device Overview .......................................................................................................................................................................... 9

2.0

Oscillator Configurations ............................................................................................................................................................ 25

3.0

Power-Managed Modes ............................................................................................................................................................. 35

4.0

Reset .......................................................................................................................................................................................... 43

5.0

Memory Organization ................................................................................................................................................................. 55

6.0

Flash Program Memory.............................................................................................................................................................. 77

7.0

8 x 8 Hardware Multiplier............................................................................................................................................................ 81

8.0

Interrupts .................................................................................................................................................................................... 83

9.0

I/O Ports ..................................................................................................................................................................................... 97

10.0 Timer0 Module ......................................................................................................................................................................... 115

11.0 Timer1 Module ......................................................................................................................................................................... 119

12.0 Timer2 Module ......................................................................................................................................................................... 125

13.0 Timer3 Module ......................................................................................................................................................................... 127

14.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 131

15.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 139

16.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 153

17.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 193

18.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 213

19.0 Comparator Module.................................................................................................................................................................. 223

20.0 Comparator Voltage Reference Module................................................................................................................................... 229

21.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 233

22.0 Special Features of the CPU.................................................................................................................................................... 239

23.0 Instruction Set Summary .......................................................................................................................................................... 259

24.0 Development Support............................................................................................................................................................... 309

25.0 Electrical Characteristics .......................................................................................................................................................... 313

26.0 DC and AC Characteristics Graphs And Tables ...................................................................................................................... 351

27.0 Packaging Information.............................................................................................................................................................. 353

Appendix A: Revision History............................................................................................................................................................. 361

Appendix B: Device Differences ........................................................................................................................................................ 361

Appendix C: Conversion Considerations ........................................................................................................................................... 362

Appendix D: Migration From Baseline to Enhanced Devices ............................................................................................................ 362

Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 363

Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 363

Index ................................................................................................................................................................................................. 365

The Microchip Web Site..................................................................................................................................................................... 375

Customer Change Notification Service .............................................................................................................................................. 375

Customer Support.............................................................................................................................................................................. 375

Reader Response .............................................................................................................................................................................. 376

PIC18F2X1X/4X1X Product Identification System............................................................................................................................. 377

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