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ESDR0502B Datasheet(PDF) 1 Page - ON Semiconductor |
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ESDR0502B Datasheet(HTML) 1 Page - ON Semiconductor |
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1 / 4 page ![]() © Semiconductor Components Industries, LLC, 2010 June, 2010 − Rev. 0 1 Publication Order Number: ESDR0502B/D ESDR0502B Transient Voltage Suppressor ESD Protection Diodes with Ultra−Low Capacitance The ESDR0502B is designed to protect voltage sensitive components from damage due to ESD in applications that require ultra low capacitance to preserve signal integrity. Excellent clamping capability, low leakage and fast response time are combined with an ultra low diode capacitance of 0.5 pF to provide best in class protection from IC damage due to ESD. The small SC−75 package is ideal for designs where board space is at a premium. The ESDR0502B can be used to protect two uni−directional lines or one bi−directional line. When used to protect one bi−directional line, the effective capacitance is 0.25 pF. Because of its low capacitance, it is well suited for protecting high frequency signal lines such as USB2.0 high speed and antenna line applications. Specification Features: • Low Capacitance 0.5 pF Typical • Low Clamping Voltage • Small Body Outline Dimensions: 0.063” x 0.063” (1.60 mm x 1.60 mm) • Low Body Height: 0.031″ (0.8 mm) • Stand−off Voltage: 5 V • Low Leakage • Response Time is Typically < 1.0 ns • IEC61000−4−2 Level 4 ESD Protection • This is a Pb−Free Device Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260 °C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact ±8.0 kV Peak Surge Power (8 x 20 ms) Ppk 20 W Peak Surge Current (8 x 20 ms) Ipp 2.0 A Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C PD 150 mW Storage Temperature Range Tstg −55 to +150 °C Junction Temperature Range TJ −55 to +150 °C Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. Device Package Shipping† ORDERING INFORMATION ESDR0502BT1G SC−75 (Pb−Free) 3000/Tape & Reel See specific marking information in the device marking column of the Electrical Characteristics tables starting on page 2 of this data sheet. DEVICE MARKING INFORMATION †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 1 3 2 PIN 1. CATHODE 2. CATHODE 3. ANODE SC−75 CASE 463 STYLE 4 MARKING DIAGRAM 1 2 3 AD = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. AD M G G 1 |
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