© Koninklijke Philips Electronics N.V. 2004

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

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consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.

Date of release: 22 October 2004

Document number: 9397 750 14092

Published in The Netherlands

Philips Semiconductors

SSTU32864

1.8 V configurable registered buffer for DDR2 RDIMM applications

19. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

4

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

5

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

5.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

5.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6

6

Functional description . . . . . . . . . . . . . . . . . . . 7

6.1

Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8

8

Recommended operating conditions. . . . . . . . 9

9

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10

10

Test information . . . . . . . . . . . . . . . . . . . . . . . . 12

10.1

Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

10.2

Output slew rate measurement. . . . . . . . . . . . 14

11

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15

12

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

12.1

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

12.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16

12.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16

12.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17

12.5

Package related soldering information . . . . . . 17

13

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18

14

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19

15

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20

16

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

17

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

18

Contact information . . . . . . . . . . . . . . . . . . . . 20