BeRex

BD23B

http: //www.berex.com

Triple Band 2-Way SMT Power Divider

1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro

Device Features and Description

 25dB Typical Isolation

 0.4dB Typical Insertion Loss

 Small Size and Low Profile

 MSL 1 moisture rating

 Lead-free/Green/RoHS compliant package

Application: commercial, space, military wireless system

 Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad

 Chip is fully passivated for enhanced performance and reliability

 Can be used without back side ground soldering

(This may degrade the performance at the high frequency edge. Refer to the following

typical test data)

Electrical specifications

Parameters

Unit

Min

Typ

Max

Frequency Range

MHz

1900

2500

Insertion Loss

dB

0.4

0.8

Isolation

dB

15

25

IRL(S11)

dB

-23

-15

ORL(S22,S33)

dB

-25

-15

Amplitude Balance

dB

0.05

0.2

Phase Balance

deg

1.0

2.0

All specifications apply with the following test conditions,

1.

Device performance is measured on BeRex evaluation board at 25C, 50 ohm system

2.

Insertion Loss: Above 3.0dB

3.

Back side ground was soldered

Absolute Maximum Ratings

Parameters

Rating

Input Power

1W CW

Storage Temperature

-55 to +155C

Operating Temperature

-40C to +85C

Operation of this device above any of these parameters may result in permanent damage.