OPA209

OPA2209

OPA4209

SBOS426B – NOVEMBER 2008 – REVISED AUGUST 2010

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

SOT23-5

DBV

OOBQ

OPA209

MSOP-8

DGK

OOAQ

SO-8

D

OPA209A

MSOP-8

DGK

OOJI

OPA2209

SO-8

D

O2209

OPA4209

TSSOP-14

PW

OPA4209

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

OPA209, OPA2209, OPA4209

UNIT

Supply Voltage

40

V

(V–) – 0.5 to (V+) + 0.5

V

10

mA

Continuous

Operating Temperature

–55 to +150

°C

Storage Temperature

–65 to +150

°C

Junction Temperature

+200

°C

Human Body Model (HBM)

3000

V

ESD Ratings:

Charged Device Model (CDM)

1000

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

For input voltages beyond the power-supply rails, voltage or current must be limited.

(3)

Short-circuit to ground, one amplifier per package.

2

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