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MMZ1005 Datasheet(PDF) 1 Page - TDK Electronics

Part # MMZ1005
Description  Chip Beads(SMD) For Signal Line
PDF  3 Pages
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Manufacturer  TDK [TDK Electronics]
Direct Link  http://www.tdk.com
Logo TDK - TDK Electronics

MMZ1005 Datasheet(HTML) 1 Page - TDK Electronics

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002-01 / 20090914 / e9412_mmz1005e.fm
• All specifications are subject to change without notice.
Chip Beads(SMD)
For Signal Line
MMZ Series MMZ1005-E Type
FEATURES
• Compared with the existing MMZ1005 type, this new product
has broad-band impedance values for higher frequency ranges.
• Size standardized for use by automatic assembly equipment.
No preferred orientation.
• Electroplated terminal electrodes accommodate reflow
soldering.
• High reliability due to an entirely monolithic structure.
• Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
• Low DC resistance structure of electrode prevents wasteful
electric power consumption.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
TEMPERATURE RANGES
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
ELECTRICAL CHARACTERISTICS
∗ Test equipment: E4991A or equivalent
Test tool
: 16192A or equivalent
Test temperature: 25±10°C
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L
× W
(3) Material code
(4) Nominal impedance
601:600
Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
PACKAGING STYLE AND QUANTITIES
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Conformity to RoHS Directive
Operating/storage
–55 to +125°C
Part No.
Impedance(
Ω)∗
DC
resistance
(
Ω)max.
Rated
current
(mA)max.
[100MHz]
[1GHz]
MMZ1005S601E
600±25%
1000±40%
0.70
300
MMZ1005S102E
1000±25%
1400±40%
1.10
250
MMZ1005S182E
1800±25%
1800±40%
1.65
200
MMZ1005A601E
600±25%
1400±40%
0.85
300
MMZ1005A102E
1000±25%
2000±40%
1.25
250
MMZ1005A152E
1500±25%
2300±40%
1.70
230
MMZ1005A182E
1800±25%
2700±40%
2.20
200
MMZ1005A222E
2200±25%
3000±40%
2.30
150
MMZ1005D121E
120±25%
1000±40%
0.70
300
MMZ1005D221E
220±25%
1700±40%
1.00
250
MMZ1005F470E
47±25%
800±40%
0.70
300
MMZ1005F750E
75±25%
1500±40%
1.00
250
MMZ1005F121E
120±25%
2300±40%
1.50
200
0.1min.
1
±0.05
0.4
0.5
0.5
Weight: 1mg
Dimensions in mm
MMZ 1005
S
601
E
T
(1)
(2)
(3)
(4)
(5) (6)
Packaging style
Quantity
Taping
10000 pieces/reel
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.


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