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LM48861TM Datasheet(PDF) 9 Page - National Semiconductor (TI) |
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LM48861TM Datasheet(HTML) 9 Page - National Semiconductor (TI) |
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9 / 16 page ![]() Application Information GENERAL AMPLIFIER FUNCTION The LM48861 headphone amplifier features National’s ground referenced architecture that eliminates the large DC- blocking capacitors required at the outputs of traditional head- phone amplifiers. A low-noise inverting charge pump creates a negative supply (CPV SS) from the positive supply voltage (V DD). The headphone amplifiers operate from these bipolar supplies, with the amplifier outputs biased about GND, in- stead of a nominal DC voltage (typically V DD/2), like traditional amplifiers. Because there is no DC component to the head- phone output signals, the large DC-blocking capacitors (typ- ically 220 μF) are not necessary, conserving board space and system cost, while improving frequency response. COMMON MODE SENSE The LM48861 features a ground (common mode) sensing feature. In noisy applications, or where the headphone jack is used as a line out to other devices, noise pick up and ground imbalance can degrade audio quality. The LM48861 COM in- put senses and corrects any noise at the headphone return, or any ground imbalance between the headphone return and device ground, improving audio reproduction. Connect COM directly to the headphone return terminal of the headphone jack (Figure 2). No additional external components are re- quired. Connect COM to GND if the common-mode sense feature is not in use. 30054101 FIGURE 2. MICRO POWER SHUTDOWN The voltage applied to the shutdown (SHDN) pin controls the LM48861’s shutdown function. Activate micro-power shut- down by applying a logic-low voltage to the SHDN pin. When active, the LM48861’s micro-power shutdown feature turns off the amplifier’s bias circuitry, reducing the supply current. The trigger point is 0.4V (max) for a logic-low level, and 1.4V (min) for a logic-high level. The low 0.1 μA (typ) shutdown cur- rent is achieved by applying a voltage that is as near as ground as possible to the SHDN pin. A voltage that is higher than ground may increase the shutdown current. There are a few ways to control the micro-power shutdown. These include using a single-pole, single-throw switch, a mi- croprocessor, or a microcontroller. When using a switch, connect an external 100k Ω pull-up resistor between the SHDN pin and GND. Connect the switch between the SHDN pin and V DD. Select normal amplifier operation by clos- ing the switch. Opening the switch connects the SHDN pin to ground, activating micro-power shutdown. The switch and re- sistor guarantee that the SHDN pin will not float. This prevents unwanted state changes. In a system with a microprocessor or microcontroller, use a digital output to apply the control voltage to the SHDN pin. Driving the SHDN pin with active circuitry eliminates the pull-up resistor. POWER DISSIPATION Power dissipation is a major concern when using any power amplifier, especially one in mobile devices. In the LM48861, the power dissipation comes from the charge pump and two operational amplifiers. Refer to the Power Dissipation vs Out- put Power curve in the Typical Performance Characteristics section of the datasheet to find the power dissipation associ- ated the output power level of the LM48861. The power dissipation should not exceed the maximum power dissipa- tion point of the micro SMD package given in equation 1. P DMAX = (TJMAX - TA) / (θJA) (1) For the LM48861TM micro SMD package, θ JA = 70°C/W. T JMAX = 150°C, and TA is the ambient temperature of the sys- tem surroundings. PROPER SELECTION OF EXTERNAL COMPONENTS Power Supply Bypassing/Filtering Proper power supply bypassing is critical for low noise per- formance and high PSRR. Place the supply bypass capaci- tors as close to the supply pins as possible. Place a 1 μF ceramic capacitor from V DD to GND. Additional bulk capaci- tance may be added as required. Charge Pump Capacitor Selection Use low ESR ceramic capacitors (less than 100m Ω) for opti- mum performance. Charge Pump Flying Capacitor (C5) The flying capacitor (C5) affects the load regulation and out- put impedance of the charge pump. A C5 value that is too low results in a loss of current drive, leading to a loss of amplifier headroom. A higher valued C5 improves load regulation and lowers charge pump output impedance to an extent. Above 2.2 μF, the R DS(ON) of the charge pump switches and the ESR of C5 and C6 dominate the output impedance. A lower value capacitor can be used in systems with low maximum output power requirements. Charge Pump Hold Capacitor (C6) The value and ESR of the hold capacitor (C6) directly affects the ripple on CPV SS. Increasing the value of C6 reduces out- put ripple. Decreasing the ESR of C6 reduces both output ripple and charge pump output impedance. A lower value ca- pacitor can be used in systems with low maximum output power requirements. Power Supply Bypassing /Filtering Proper power supply bypassing is critical for low noise per- formance and high PSRR. Place the supply bypass capaci- tors as close to the device as possible. Typical applications employ a voltage regulator with 10µF and 0.1µF bypass ca- pacitors that increase supply stability. These capacitors do not eliminate the need for bypassing of the LM48861 supply pins. A 1µF capacitor is recommended. Input Capacitor Selection The LM48861 requires input coupling capacitors. Input ca- pacitors block the DC component of the audio signal, elimi- nating any conflict between the DC component of the audio source and the bias voltage of the LM48861. The input ca- pacitors create a high-pass filter with the input resistors R IN. 9 www.national.com |
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