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PBLS2001S Datasheet(PDF) 3 Page - NXP Semiconductors

Part # PBLS2001S
Description  20 V PNP BISS loadswitch
PDF  16 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PBLS2001S Datasheet(HTML) 3 Page - NXP Semiconductors

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PBLS2001S_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 24 August 2009
3 of 16
NXP Semiconductors
PBLS2001S
20 V PNP BISS loadswitch
5.
Limiting values
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm2.
[3]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
TR1; PNP low VCEsat (BISS) transistor
VCBO
collector-base voltage
open emitter
-
−20
V
VCEO
collector-emitter voltage
open base
-
−20
V
VEBO
emitter-base voltage
open collector
-
−5V
IC
collector current
-
−3A
ICM
peak collector current
single pulse;
tp ≤ 1ms
-
−5A
IB
base current
-
−0.5
A
IBM
peak base current
single pulse;
tp ≤ 1ms
-
−1A
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -
0.55
W
[2] -
0.87
W
[3] -
1.43
W
TR2; NPN resistor-equipped transistor
VCBO
collector-base voltage
open emitter
-
50
V
VCEO
collector-emitter voltage
open base
-
50
V
VEBO
emitter-base voltage
open collector
-
10
V
VI
input voltage
positive
-
+12
V
negative
-
−10
V
IO
output current
-
100
mA
ICM
peak collector current
single pulse;
tp ≤ 1ms
-
100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -
0.2
W
Per device
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -
0.7
W
[2] -
1.0
W
[3] -
1.5
W
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C



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