PMEG6002EB_PMEG6002TV_1

© NXP B.V. 2006. All rights reserved.

Product data sheet

Rev. 01 — 24 November 2006

7 of 10

NXP Semiconductors

PMEG6002EB; PMEG6002TV

11. Soldering

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 7.

Reflow soldering footprint SOD523 (SC-79)

Reflow soldering is the only recommended soldering method.

Fig 8.

Reflow soldering footprint SOT666

mgs343

1.80

1.90

0.30

0.40

0.50

1.20

0.60

2.15

solder lands

solder resist

occupied area

solder paste

solder lands

solder resist

placement area

occupied area

0.075

Dimensions in mm

2.75

2.45

2.10

1.60

1.20

2.20

2.50

2.00 1.70 1.00

0.30 (2

×)

0.15

(4

×)

0.375

(4

×)

0.40

(6

×)

0.55

(2

×)