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410 Datasheet(PDF) 66 Page - Intel Corporation

Part # 410
Description  Celeron M Processor on 65 nm Process
PDF  71 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

410 Datasheet(HTML) 66 Page - Intel Corporation

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Thermal Specifications and Design Considerations
66
Datasheet
on-die temperature gradients between the location of the thermal diode and the hottest
location on the die, and time based variations in the die temperature measurement.
Time based variations can occur when the sampling rate of the thermal diode (by the
thermal sensor) is slower than the rate at which the TJ temperature can change.
Offset between the thermal diode-based temperature reading and the Intel Thermal
Monitor reading may be characterized using the Intel Thermal Monitor’s Automatic
mode activation of thermal control circuit. This temperature offset must be taken into
account when using the processor thermal diode to implement power management
events. This offset is different than the diode Toffset value programmed into the Intel
Core Duo and Intel Core Solo processors’ MSR.
Table 18, Table 19, Table 20, and Table 21 provide the diode interface and
specifications. Two different sets of diode parameters are listed in Table 19 and
Table 20. The Diode Model parameters (Table 19) apply to traditional thermal sensors
that use the Diode Equation to determine the processor temperature. Transistor Model
parameters (Table 20) have been added to support thermal sensors that use the
transistor equation method. The Transistor Model may provide more accurate
temperature measurements when the diode ideality factor is closer to the maximum or
minimum limits. Please contact your external thermal sensor supplier for their
recommendation. This thermal diode is separate from the Intel Thermal Monitor's
thermal sensor and cannot be used to predict the behavior of the Intel Thermal Monitor.
NOTES:
1.
Intel does not support or recommend operation of the thermal diode under reverse bias.
Intel does not support or recommend operation of the thermal diode when the processor
power supplies are not within their specified tolerance range.
2.
Characterized across a temperature range of 50 – 100°C.
3.
Not 100% tested. Specified by design characterization.
4.
The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by
the diode equation:
IFW = IS * (e
qV
D
/nkT –1)
where IS = saturation current, q = electronic charge, VD = voltage across the diode, k =
Boltzmann Constant, and T = absolute temperature (Kelvin).
Table 18.
Thermal Diode Interface
Signal Name
Pin/Ball Number
Signal Description
THERMDA
A24
Thermal diode anode
THERMDC
A25
Thermal diode cathode
Table 19.
Thermal Diode Parameters using Diode Model
Symbol
Parameter
Min
Typ
Max
Unit
Notes
IFW
Forward Bias Current
5
-
200
µA
1
n
Diode Ideality Factor
1.000
1.009
1.050
-
2, 3, 4
R
T
Series Resistance
2.79
4.52
6.24
Ω
2, 3, 5



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