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IR3876MBF

Stencil Design

The Stencil apertures for the lead lands should be approximately 80% of the area of the lead lads.

Reducing the amount of solder deposited will minimize the occurrences of lead shorts. If too much

solder is deposited on the center pad the part will float and the lead lands will open.

The maximum length and width of the land pad stencil aperture should be equal to the solder resist

opening minus an annular 0.2mm pull back in order to decrease the risk of shorting the center land

to the lead lands when the part is pushed into the solder paste.