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SPU07N20G Datasheet(PDF) 2 Page - Infineon Technologies AG |
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SPU07N20G Datasheet(HTML) 2 Page - Infineon Technologies AG |
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2 / 10 page ![]() SPD 07N20 G Rev. 2.4 Page 2 2008-09-01 Thermal Characteristics Parameter Values Symbol Unit typ. max. min. Characteristics RthJC - 3.1 K/W Thermal resistance, junction - case - Thermal resistance, junction - ambient, leded RthJA - 100 - - - - 75 50 SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area1) RthJA Electrical Characteristics, at Tj = 25 ˚C, unless otherwise specified Parameter Symbol Unit Values min. max. typ. Static Characteristics Drain- source breakdown voltage VGS = 0 V, ID = 0.25 mA - V(BR)DSS 200 - V Gate threshold voltage, VGS = VDS ID = 1 mA VGS(th) 4 3 2.1 Zero gate voltage drain current VDS = 200 V, VGS = 0 V, Tj = 25 ˚C VDS = 200 V, VGS = 0 V, Tj = 125 ˚C - - IDSS µA 1 100 0.1 - Gate-source leakage current VGS = 20 V, VDS = 0 V IGSS - 10 nA 100 Drain-Source on-state resistance VGS = 10 V, ID = 4.5 A RDS(on) - 0.3 0.4 Ω 1 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain connection. PCB is vertical without blown air. |
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