IRDC3841W

10/26/2009

Solder Resist

It is recommended that the lead lands are Non Solder Mask Defined (NSMD). The solder resist

should be pulled away from the metal lead lands by a minimum of 0.025mm to ensure NSMD

pads.

The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist

onto the copper of 0.05mm to accommodate solder resist mis-alignment.

Ensure that the solder resist in between the lead lands and the pad land is

≥ 0.15mm due to the

high aspect ratio of the solder resist strip separating the lead lands from the pad land.