Analog Integrated Circuit Device Data

Freescale Semiconductor

13

908E624

ELECTRICAL CHARACTERISTICS

DYNAMIC ELECTRICAL CHARACTERISTICS

LIN PHYSICAL LAYER (CONTINUED)

Output Current Shutdown Delay

—10

—

μs

SPI INTERFACE TIMING

SPI Operating Recommended Frequency

0.25

—

4.0

MHz

L1 AND L2 INPUTS

Wake-Up Filter Time (22)

8.0

20

38

μs

WINDOW WATCHDOG CONFIGURATION TERMINAL (WDCONF)

Watchdog Period

—

—

97

10.558

99.748

150

—

—

205

ms

STATE MACHINE TIMING

0.65

1.0

1.35

ms

Interrupt Low-Level Duration

7.0

10

13

μs

Normal Request Mode Timeout (26)

97

150

205

ms

Delay Between SPI Command and HS1/HS2/HS3 Turn On (23), (24)

—3.0

10

μs

Delay Between SPI Command and HS1/HS2/HS3 Turn Off (23), (24)

—3.0

10

μs

Delay Between Normal Request and Normal Mode After W/D Trigger

Command (25)

6.0

35

70

μs

Delay Between SS Wake-Up (SS LOW to HIGH) and Normal Request Mode

(VDD On and Reset High)

15

40

80

μs

Delay Between SS Wake-Up (SS LOW to HIGH) and First Accepted SPI

Command

90

—

N/A

μs

Delay Between Interrupt Pulse and First SPI Command Accepted

30

—

N/A

μs

Minimum Time Between Two Rising Edges on SS

15

—

—

μs

Notes

22.

This parameter is guaranteed by process monitoring but is not production tested.

23.

Delay between turn-on or turn-off command and high side on or high side off, excluding rise or fall time due to external load.

24.

Delay between the end of the SPI command (rising edge of the SS) and start of device activation/deactivation.

25.

This parameter is guaranteed by process monitoring but it is not production tested.

26.

Also see Figure 10 on page 17

Table 4. Dynamic Electrical Characteristics (continued)

All characteristics are for the analog chip only. Please refer to the 68HC908EY16 data sheet for characteristics of the

Characteristic

Symbol

Min

Typ

Max

Unit