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ZXMS6006DG Datasheet(PDF) 3 Page - Diodes Incorporated

Part # ZXMS6006DG
Description  60V N-CHANNEL SELF PROTECTED ENHANCEMENT MODE INTELLIFET MOSFET
PDF  9 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

ZXMS6006DG Datasheet(HTML) 3 Page - Diodes Incorporated

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ZXMS6006DG
Document number: DS35142 Rev. 1 - 2
3 of 9
www.diodes.com
December 2010
© Diodes Incorporated
ZXMS6006DG
A Product Line of
Diodes Incorporated
IntelliFET
® is a trademark of Diodes Incorporated, registered in the United States and other jurisdictions worldwide.
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Units
Continuous Drain-Source Voltage
VDS
60
V
Drain-Source Voltage for Short Circuit Protection
VDS(SC)
16
V
Continuous Input Voltage
VIN
-0.5 ... +6
V
Continuous Input Current @-0.2V
≤ VIN ≤ 6V
Continuous Input Current @VIN < -0.2V or VIN > 6V
IIN
No limit
│IIN │≤2
mA
Pulsed Drain Current @VIN = 3.3V
IDM
11
A
Pulsed Drain Current @VIN = 5V
IDM
13
A
Continuous Source Current (Body Diode) (Note 4)
IS
2
A
Pulsed Source Current (Body Diode)
ISM
12
A
Unclamped Single Pulse Inductive Energy,
TJ = 25°C, ID = 0.5A, VDD = 24V
EAS
490
mJ
Electrostatic Discharge (Human Body Model)
VESD
4000
V
Charged Device Model
VCDM
1000
V
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Units
Power Dissipation at TA = 25°C (Note 4)
Linear Derating Factor
PD
1.3
10.4
W
mW/
°C
Power Dissipation at TA = 25°C (Note 5)
Linear Derating Factor
PD
3.0
24
W
mW/
°C
Thermal Resistance, Junction to Ambient (Note 4)
RθJA
96
°C/W
Thermal Resistance, Junction to Ambient (Note 5)
RθJA
42
°C/W
Thermal Resistance, Junction to Case (Note 6)
RθJC
12
°C/W
Operating Temperature Range
TJ
-40 to +150
°C
Storage Temperature Range
TSTG
-55 to +150
°C
Notes:
4. For a device surface mounted on 15mm x 15mm single sided 1oz weight copper on 1.6mm FR4 board, in still air conditions.
5. For a device surface mounted on 50mm x 50mm single sided 2oz weight copper on 1.6mm FR4 board, in still air conditions.
6. Thermal resistance between junction and the mounting surfaces of drain and source pins.



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