ZXTP26020DMF

Document number: DS32101 Rev. 1 - 2

1 of 6

www.diodes.com

May 2010

© Diodes Incorporated

A Product Line of

Diodes Incorporated

ZXTP26020DMF

Features

•

Epitaxial Planar Die Construction

•

Complementary NPN Type Available (ZXTN26020DMF)

•

•

•

Surface Mount Package Suited for Automated Assembly

•

Ultra-Small Surface Mount Package

•

Qualified to AEC-Q101 Standards for High Reliability

•

Lead, Halogen and Antimony Free, RoHS Compliant (Note 1)

•

“Green” Device (Note 2)

•

ESD rating: 400V-MM, 8KV-HBM

Mechanical Data

•

Case: DFN1411-3

•

Case Material: Molded Plastic, “Green” Molding Compound.

UL Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020

•

Terminals: Finish – NiPdAu over Copper lead frame. Solderable

per MIL-STD-202, Method 208

•

Weight: 0.003 grams (approximate)

Applications

•

MOSFET and IGBT gate driving

•

DC-DC conversion

•

Interface between low voltage IC and Load

•

Load disconnect switch

Ordering Information

Product

Reel size (inches)

Tape width (mm)

Quantity per reel

ZXTP26020DMFTA

7

8

3000

Notes:

1. No purposefully added lead. Halogen and Antimony Free.

2. Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com

Marking Information

Date Code Key

Year

2009

2010

2011

2012

2013

2014

2015

2016

Code

W

X

Y

Z

A

B

C

D

Month

Jan

Feb

Mar

Apr

May

Jun

Jul

Aug

Sep

Oct

Nov

Dec

Code

1

2

3

4

5

6

7

8

9

O

N

D

Z2= Product Type Marking Code

YM = Date Code Marking

Y = Year (ex: W = 2009)

M = Month (ex: 9 = September)

Top view

Device Symbol

Bottom view

Pin-Out Top view

Z2

C

E

B