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AP6714 Datasheet(PDF) 4 Page - Diodes Incorporated

Part # AP6714
Description  1.8MHz SYNCHRONOUS BOOST CONVERTER
PDF  15 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AP6714 Datasheet(HTML) 4 Page - Diodes Incorporated

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AP6714
1.8MHz SYNCHRONOUS BOOST CONVERTER
AP6714 Rev. 4
4 of 15
FEBRUARY 2009
www.diodes.com
© Diodes Incorporated
Electrical Characteristics
(VCC = 3.6V, TA = 25
oC, unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ.
Max
Unit
GENERAL
ISTB
Standby Current
VCC =3.6V ,VEN=0V
-
0.5
1
µA
ICC
Supply Current
VCC =EN = 3.6V, FB = 1.5V
-
150
300
µA
REFERENCE
VREF
Reference Output Voltage
1.205
1.23
1.255
V
ΔV
REF/ΔT Tempco of Reference
-40
oC
≤T≤125 oC
30
50
ppm/
oC
VREF(LOAD) Reference Load Regulation
10mA < ILOAD < 200mA
-
4.5
10
mV
VREF(LINE) Reference Line Regulation
2.8 < VCC < 5.5V
-
1.3
5
mV
OSCILLATOR
FOSC
OSC Frequency
1400
1800
2200
KHz
STEP-UP DC-TO-DC
ΔV
OUT/ΔT Tempco of Output Voltage
IOUT=10mA, -40
oC
≤T≤85 oC
50
100
ppm/
oC
FB Input Leakage Current
FB = 1.25V
-100
0.01
+100
nA
Duty
Step-Up Maximum Duty Cycle FB = 0V
80
85
90
%
IOUT
OUT Leakage Current
VLX = 0V, OUT = 5V
-
1
5
µA
ILXL
LX Leakage Current
VLX = OUT = 5V
-
2
5
µA
RDS(ON)
Switch On-Resistance
N channel, Vcc= 5V
-
200
-
m
Ω
P channel, Vcc= 5V
-
300
-
ILM
N-Channel Current Limit
VIN=1.5V (Note 4)
1.2
1.4
1.6
A
THERMAL-SHUTDOWN PROTECTION
Thermal Shutdown
-
150
-
oC
Thermal Hysteresis
-
40
-
oC
LOGIC INPUTS
EN Input Low Level
1.5V < VCC < 5.5V
-
-
0.4
V
EN Input High Level
1.5V < VCC < 5.5V
0.8
-
-
V
OVER CURRENT PROTECTION
VOCP
Over Current Protection
Voltage
ROCP=0.1Ω
-
0.16
-
V
THERMAL RESISTANCE
θ
JA
Thermal Resistance
Junction-to-Ambient
MSOP-10L (Note 5)
161
oC/W
θ
JC
Thermal Resistance
Junction-to-Case
MSOP-10L (Note 5)
43
oC/W
Notes:
4. The step-up current limit in startup refers to the LX switch current limit, not the output current limit.
5. Test condition for MSOP-10L: Device mounted on 2oz copper, minimum recommended pad layout on top & bottom layer with thermal vias,
double sided FR-4 PCB.



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