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MMBD4448HTM Datasheet(PDF) 1 Page - Diodes Incorporated |
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MMBD4448HTM Datasheet(HTML) 1 Page - Diodes Incorporated |
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1 / 3 page  MMBD4448HTM SURFACE MOUNT FAST SWITCHING DIODE ARRAY Features • Fast Switching Speed • Ultra-Small Surface Mount Package • For General Purpose Switching Applications • High Conductance • Lead Free/RoHS Compliant (Note 3) • "Green" Device (Notes 4 and 5) Mechanical Data • Case: SOT-26 • Case Material: Molded Plastic, "Green" Molding Compound, Note 5. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Copper leadframe). • Orientation: See Diagram • Marking Information: See Page 2 • Ordering Information: See Page 2 • Weight: 0.016 grams (approximate) TOP VIEW SOT-26 Internal Schematic TOP VIEW Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Non-Repetitive Peak Reverse Voltage VRM 100 V Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 80 V RMS Reverse Voltage VR(RMS) 57 V Forward Continuous Current (Note 1) IFM 500 mA Average Rectified Output Current (Note 1) IO 250 mA Non-Repetitive Peak Forward Surge Current @ t = 1.0 μs @ t = 1.0s IFSM 4.0 2.0 A Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 1) PD 350 mW Thermal Resistance Junction to Ambient Air (Note 1) RθJA 357 °C/W Operating and Storage Temperature Range TJ , TSTG -65 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Max Unit Test Condition Reverse Breakdown Voltage (Note 2) V(BR)R 80 ⎯ V IR = 2.5μA Forward Voltage VF 0.62 ⎯ ⎯ ⎯ 0.72 0.855 1.0 1.25 V IF = 5.0mA IF = 10mA IF = 100mA IF = 150mA Reverse Current (Note 2) IR ⎯ 100 50 30 25 nA μA μA nA VR = 70V VR = 75V, TJ = 150°C VR = 25V, TJ = 150°C VR = 20V Total Capacitance CT ⎯ 3.5 pF VR = 6, f = 1.0MHz Reverse Recovery Time trr ⎯ 4.0 ns VR = 6V, IF = 5mA Notes: 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. Short duration pulse test used to minimize self-heating effect. 3. No purposefully added lead. 4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants MMBD4448HTM Document number: DS30302 Rev. 7 - 2 1 of 3 www.diodes.com March 2008 © Diodes Incorporated Please click here to visit our online spice models database. |
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