MMSZ5263B

Document number: DS31652 Rev. 4 - 2

1 of 3

www.diodes.com

September 2009

© Diodes Incorporated

MMSZ5263B

500mW SURFACE MOUNT ZENER DIODE

Features

•

Planar Die Construction

•

500mW Power Dissipation

•

General Purpose, Medium Current

•

Ideally Suited for Automated Assembly Processes

•

Lead, Halogen and Antimony Free, RoHS Compliant

•

"Green" Device (Note 4)

•

Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

•

Case: SOD-123

•

Case Material: Molded Plastic, “Green” Molding Compound.

UL Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020

•

Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

•

Polarity: Cathode Band

•

Marking Information: See Page 2

•

Ordering Information: See Page 2

•

Weight: 0.01 grams (approximate)

Characteristic

Symbol

Value

Unit

Forward Voltage (Note 3)

0.9

V

Thermal Characteristics

Characteristic

Symbol

Value

Unit

500

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

350

°C/W

Thermal Resistance, Junction to Lead (Note 2)

150

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Type

Number

Type

Code

Zener Voltage Range (Note 3)

Test

Current

Maximum Zener

Impedance (Note 5)

Maximum Reverse

Leakage Current (Note 3)

= 0.25mA

Nom (V)

Min (V)

Max (V)

mA

Ω

μA

V

MMSZ5263B

M8

56

53.20

58.80

2.2

150

1300

0.1

43

Notes:

1. Device mounted on FR-4 substrate, single-sided, PC boards, with minimum recommended pad layout.

2. Thermal Resistance measurement obtained via infrared scan method.

3. Short duration pulse test used to minimize self-heating effect.

4. No purposefully added lead. Halogen and Antimony Free.

5. f = 1KHz.

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