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ZXCT1012 Datasheet(PDF) 7 Page - Diodes Incorporated |
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ZXCT1012 Datasheet(HTML) 7 Page - Diodes Incorporated |
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7 / 10 page ![]() ZXCT1012 Issue 1 - December 2006 7 www.zetex.com © Zetex Semiconductors plc 2006 Power dissipation The maximum allowable power dissipation of the device for normal operation (PMAX), is a function of the package junction to ambient thermal resistance ( JA), maximum junction temperature (TJMAX), and ambient temperature (Tamb), according to the expression: PMAX = (TJMAX – Tamb) / JA The device power dissipation, PD is given by the expression: PD=IOUT.(VIN-VOUT) watts Care must be taken when using this device at large input voltages and large sense voltages to prevent too much power dissipation. VIN = 20V VSENSE = 2.5V ROUT = 100 IOUT = 2.5 x 0.01 = 25mA VOUT = IOUT x ROUT = 25mA x 100 = 2.5V ∴ P D = 25mA (20 - 2.5)V = 438mW Power Dissipation 0 100 200 300 400 500 600 0 255075 100 125 150 TA - Ambient temperature (°C) TDFN3x3-5 TSOT23-5 |
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