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APTCV60TLM24T3G Datasheet(PDF) 2 Page - Microsemi Corporation

Part # APTCV60TLM24T3G
Description  CoolMOS & Trench Field Stop IGBT
PDF  13 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

APTCV60TLM24T3G Datasheet(HTML) 2 Page - Microsemi Corporation

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APTCV60TLM24T3G
www.microsemi.com
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Q1 & Q4 Absolute maximum ratings
Q1 & Q4 Electrical Characteristics
Symbol
Characteristic
Test Conditions
Min
Typ
Max
Unit
VGS = 0V,VDS = 600V
Tj = 25°C
350
IDSS
Zero Gate Voltage Drain Current
VGS = 0V,VDS = 600V
Tj = 125°C
600
µA
RDS(on)
Drain – Source on Resistance
VGS = 10V, ID = 47.5A
24
m
Ω
VGS(th)
Gate Threshold Voltage
VGS = VDS, ID = 5mA
2.1
3
3.9
V
IGSS
Gate – Source Leakage Current
VGS = ±20 V, VDS = 0V
200
nA
Q1 & Q4 Dynamic Characteristics
Symbol
Characteristic
Test Conditions
Min
Typ
Max
Unit
Ciss
Input Capacitance
14.4
Coss
Output Capacitance
VGS = 0V ; VDS = 25V
f = 1MHz
17
nF
Qg
Total gate Charge
300
Qgs
Gate – Source Charge
68
Qgd
Gate – Drain Charge
VGS = 10V
VBus = 300V
ID = 95A
102
nC
Td(on)
Turn-on Delay Time
21
Tr
Rise Time
30
Td(off)
Turn-off Delay Time
100
Tf
Fall Time
Inductive Switching (125°C)
VGS = 10V
VBus = 400V
ID = 95A
RG = 2.5Ω
45
ns
Eon
Turn-on Switching Energy
1350
Eoff
Turn-off Switching Energy
Inductive switching @ 25°C
VGS = 10V ; VBus = 400V
ID = 95A ; RG = 2.5Ω
1040
µJ
Eon
Turn-on Switching Energy
2200
Eoff
Turn-off Switching Energy
Inductive switching @ 125°C
VGS = 10V ; VBus = 400V
ID = 95A ; RG = 2.5Ω
1270
µJ
RthJC
Junction to Case Thermal Resistance
0.27
°C/W
Symbol
Parameter
Max ratings
Unit
VDSS
Drain - Source Breakdown Voltage
600
V
Tc = 25°C
95
ID
Continuous Drain Current
Tc = 80°C
70
IDM
Pulsed Drain current
260
A
VGS
Gate - Source Voltage
±20
V
RDSon
Drain - Source ON Resistance
24
m
Ω
PD
Maximum Power Dissipation
Tc = 25°C
462
W
IAR
Avalanche current (repetitive and non repetitive)
15
A
EAR
Repetitive Avalanche Energy
3
EAS
Single Pulse Avalanche Energy
1900
mJ



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