DSPIC30F2010 datasheet(148/202 Pages) MICROCHIP

148 / 202 page

dsPIC30F2010

DS70118J-page 148

22.1

DC Characteristics

TABLE 22-1:

OPERATING MIPS VS. VOLTAGE

VDD Range

Temp Range

Max MIPS

dsPIC30F2010-30I

dsPIC30F2010-20E

4.5-5.5V

-40°C to 85°C

—

4.5-5.5V

-40°C to 125°C

—

3.0-3.6V

-40°C to 85°C

—

3.0-3.6V

-40°C to 125°C

—

2.5-3.0V

-40°C to 85°C

—

TABLE 22-2:

THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

dsPIC30F2010-30I

Operating Junction Temperature Range

-40

—

+125

°C

Operating Ambient Temperature Range

-40

—

+85

°C

dsPIC30F2010-20E

Operating Junction Temperature Range

-40

—

+150

°C

Operating Ambient Temperature Range

-40

—

+125

°C

Power Dissipation:

Internal chip power dissipation:

PINT + PI/O

I/O Pin power dissipation:

Maximum Allowed Power Dissipation

PDMAX

(TJ - TA)/

θJA

TABLE 22-3:

THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Notes

Package Thermal Resistance, 28-pin SOIC (SO)

θJA

48.3

—

°C/W

Package Thermal Resistance, 28-pin QFN

θJA

33.7

—

°C/W

Package Thermal Resistance, 28-pin SPDIP (SP)

θJA

—

°C/W

Note 1:

Junction to ambient thermal resistance, Theta-ja (

θJA) numbers are achieved by package simulations.

PINT

VDD

IDD

IOH

∑

–

⎝⎠

⎛⎞

PI/O

VDD

VOH

–

{} IOH

()

∑

VOL

I OL

()

∑

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