DSPIC30F2010 datasheet(191/202 Pages) MICROCHIP

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DS70118J-page 191

dsPIC30F2010

APPENDIX A:

REVISION HISTORY

Revision F (May 2006)

Previous versions of this data sheet contained

Advance or Preliminary Information. They were

distributed with incomplete characterization data.

This revision reflects these updates:

• Supported I2C Slave addresses

(see Table 16-1)

• 10-bit A/D High-speed Conversion timing

requirements (see Section 18.0 “10-bit High-

Speed Analog-to-Digital Converter (ADC)

Module”

• Operating Current (IDD) specifications

(see Table 22-5)

• Idle Current (IIDLE) specifications

(see Table 22-6)

• Power-down Current (IPD) specifications

(see Table 22-7)

• I/O pin Input specifications

(see Table 22-8)

• BOR voltage limits

(see Table 22-10)

• PLL Clock Timing specifications

(see Table 22-14)

• PLL Jitter specifications

(see Table 22-15)

• Internal RC Accuracy specifications

(see Table 22-17)

• Watchdog Timer time-out limits

(see Table 22-20)

• Additional minor corrections throughout

document.

Revision G (December 2006)

This revision includes updates to the packaging

diagrams.

Revision H (March 2008)

This revision reflects these updates:

• Changed the location of the input reference in the

10-bit High-Speed ADC Functional Block Diagram

(see Figure 18-1)

• Removed incorrect reference to LVDIN function

on Port B (see Figure 1-1), previously shown on

pin 4 of SDIP and SOIC packages and pin 1 of

QFN package (see Pin Diagrams)

• Removed erroneous reference to use of the Fast

RC Oscillator with the PLL (see Section 19.2.4

“Phase-Locked Loop (PLL)”)

• Added FUSE Configuration Register (FICD)

details (see Section 19.6 “Device Configuration

Registers” and Table 19-8)

• Electrical Specifications:

- Resolved TBD values for parameters DO10,

DO16, DO20, and DO26 (see Table 22-9)

- 10-bit High-Speed ADC tPDU timing parame-

ter (time to stabilize) has been updated from

20 µs typical to 20 µs maximum (see

Table 22-39)

- Parameter OS65 (Internal RC Accuracy) has

been expanded (see Table 22-18) to reflect

multiple Min and Max values for different tem-

peratures

- Parameter D134 (Erase/Write Cycle Time)

has been updated to include Min and Max

values and the Typ value has been removed

(see Table 22-11)

- Parameter DC12 (RAM Data Retention Volt-

age) has been updated to include a Min value

(see Table 22-4)

- Removed parameters OS62 (Internal FRC

Jitter) and OS64 (Internal FRC Drift) and

Note 2 from AC Characteristics (see

Table 22-17)

- Parameter OS63 (Internal FRC Accuracy)

has been expanded to reflect multiple Min

and Max values for different temperatures

(see Table 22-17)

- Updated Min and Max values and Conditions

for parameter SY11 and updated Min, Typ,

and Max values and Conditions for

parameter SY20 (see Table 22-20)

• Additional minor corrections throughout the

document

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