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CP761R Datasheet(PDF) 1 Page - Central Semiconductor Corp |
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CP761R Datasheet(HTML) 1 Page - Central Semiconductor Corp |
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1 / 2 page ![]() GEOMETRY PROCESS DETAILS PRINCIPAL DEVICE TYPES CEDM8001 CMNDM8001 GROSS DIE PER 6 INCH WAFER 123,000 PROCESS CP761R Small Signal MOSFET P-Channel Enhancement-Mode MOSFET Chip Die Size 14.2 x 14.2 MILS Die Thickness 3.9 MILS Gate Bonding Pad Area 3.94 x 3.94 MILS Source Bonding Pad Area 3.94 x 7.08 MILS Top Side Metalization Al-Si - 35,000Å Back Side Metalization Au - 12,000Å www.centr a lsemi.com R1 (2-September 2010) |
Similar Part No. - CP761R |
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Similar Description - CP761R |
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