Sheet No.: D1-A00801EN

5

GL100MN3MPx

■ Design Considerations

Design Guidelines

1.

Allow for natural degradation of the LED as a result of long continuous operation. This part will have 50% deg-

radation in output after 5 years of continuous use.

2.

This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.

■ Manufacturing Guidelines

Soldering Instructions

1.

Sharp recommends soldering no more than once when using solder reflow methods.

2.

When using solder reflow methods, follow reflow soldering temperature profile shown in Fig. 4. Sharp recom-

mends checking the process to make sure these parameters are not exceeded; exceeding these parameters

can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires, or

other similar failure modes.

3.

If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the

part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 4.

4.

If hand soldering, use temperatures

≤260° for ≤3 seconds. Do not dip-solder or VPS-solder this part.

5.

Do not subject the package to excessive mechanical force during soldering as it may cause deformation or

defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-

age due to the PCB flexing during the soldering process.

Cleaning Instructions

1.

Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the

optical characteristics.

2.

Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.

3.

Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning

time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-

tions to confirm the harmlessness of the ultrasonic cleaning methods.

4.

Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.

Fig. 4 Reflow Soldering Temperature Profile

200°C

25°C

240°C MAX.

120 s MAX.

90 s MAX.

60 s MAX.

10 s MAX.

165°C MAX.

1 ~ 4°C/s

1 ~ 4°C/s

1 ~ 4°C/s