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TLE4966-3K Datasheet(PDF) 13 Page - Infineon Technologies AG |
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TLE4966-3K Datasheet(HTML) 13 Page - Infineon Technologies AG |
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13 / 15 page ![]() Datasheet 13 Rev.1.0, 2010-09-20 TLE4966-3K Package Information 7 Package Information 7.1 Package Marking Z3 Year (y) = 0...9 Month (m) = 1...9, o - October n- November d- December s Figure 7 Marking PG-TSOP-6-6-5 7.2 Distance between Chip and Package Surface Branded Side mm ± 0.1 0.56 Figure 8 Distance Chip to Upper Side of IC 7.3 Package Outlines Figure 9 PG-TSOP-6-6-5 (Plastic Thin Small Outline Package) 1.1 MAX. acc. to DIN 6784 +0.2 0.1 MAX. (2.25) +0.1 -0.05 0.35 (0.35) GPX09300 2.9 ±0.2 B 0.2 M B 6x 0.95 1.9 A 0.2 A M 0.15 +0.1 -0.06 3 2 1 4 5 6 |
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