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OPA322SAIDBVT Datasheet(PDF) 5 Page - Texas Instruments

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Part # OPA322SAIDBVT
Description  20-MHz, Low-Noise, 1.8-V, RRI/O, CMOS Operational Amplifier with Shutdown
PDF  29 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OPA322SAIDBVT Datasheet(HTML) 5 Page - Texas Instruments

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OPA322, OPA322S
OPA2322, OPA2322S
OPA4322, OPA4322S
www.ti.com
SBOS538A
– JANUARY 2011 – REVISED MAY 2011
THERMAL INFORMATION
OPA322
OPA322S
THERMAL METRIC(1)
DBV
DBV
UNITS
5 PINS
6 PINS
θJA
Junction-to-ambient thermal resistance
219.3
TBD
θJC(top)
Junction-to-case(top) thermal resistance
107.5
TBD
θJB
Junction-to-board thermal resistance
57.5
TBD
°C/W
ψJT
Junction-to-top characterization parameter
7.4
TBD
ψJB
Junction-to-board characterization parameter
56.9
TBD
θJC(bottom)
Junction-to-case(bottom) thermal resistance
n/a
TBD
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION
OPA2322
OPA2322S
THERMAL METRIC(1)
D
DRG
DGK
DGS
8 PINS
8 PINS
8 PINS
10 PINS
UNITS
θJA
Junction-to-ambient thermal resistance
122.6
50.6
174.8
TBD
θJC(top)
Junction-to-case(top) thermal resistance
67.1
54.9
43.9
TBD
θJB
Junction-to-board thermal resistance
64.0
25.2
95.0
TBD
°C/W
ψJT
Junction-to-top characterization parameter
13.2
0.6
2.0
TBD
ψJB
Junction-to-board characterization parameter
63.4
25.3
93.5
TBD
θJC(bottom)
Junction-to-case(bottom) thermal resistance
n/a
5.7
n/a
TBD
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION
OPA4322
OPA4322S
THERMAL METRIC(1)
PW
PW
14 PINS
16 PINS
UNITS
θJA
Junction-to-ambient thermal resistance
109.8
TBD
θJC(top)
Junction-to-case(top) thermal resistance
34.9
TBD
θJB
Junction-to-board thermal resistance
52.5
TBD
°C/W
ψJT
Junction-to-top characterization parameter
2.2
TBD
ψJB
Junction-to-board characterization parameter
51.8
TBD
θJC(bottom)
Junction-to-case(bottom) thermal resistance
n/a
TBD
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright
© 2011, Texas Instruments Incorporated
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