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AS8221-ASSP Datasheet(PDF) 6 Page - ams AG |
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AS8221-ASSP Datasheet(HTML) 6 Page - ams AG |
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6 / 41 page ![]() AS8221 Datasheet - A b s o l u t e M a x i m u m R a t i n g s www.austriamicrosystems.com/flexray/AS8221 Revision 1.4 6 - 41 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Parameter Min Max Units Notes Battery Supply Voltage (VBAT) -0.3 +50 V Supply Voltage (VCC) -0.3 +7.0 V Supply Voltage (VIO) -0.3 +7.0 V DC Voltage at EN, STBN, ERRN, TxD, RxD, TxEN, BGE, RxEN -0.3 VIO + 0.3 V VIO < VCC DC Voltage on pin WAKE, INH1, INH2 -0.3 VBAT + 0.3 DC Voltage at BP and BM -40 +50 V Input current (latchup immunity) -100 100 mA According to JEDEC 78 Electrostatic discharge at bus lines BP, BM, VBAT, WAKE -4 +4 kV According to AEC-Q100-002 Electrostatic discharge -2 +2 kV According to AEC-Q100-002 Transient voltage on BP, BM -200 +200 V According to ISO7637 part3 test pulses a and b; class C; RL=45 Ω, CL= 100 pF; (see Figure 18 on page 30). Transient voltage on VBAT -200 +200 V According to ISO7637 part2 test pulses 1, 2, 3a and 3b; class C; RL=45 Ω, CL= 100 pF; (see Figure 18 on page 30). +6.5 +50 V According to ISO7637 part2 test pulse 4; class C; RL=45 Ω, CL= 100 pF; (see Figure 18 on page 30). +50 According to ISO7637 part2 test pulse 5b; class C; RL=45 Ω, CL= 100 pF; (see Figure 18 on page 30). Total power dissipation (all supplies and outputs) 150 mW Storage temperature -55 +150 ºC Junction temperature -40 +150 ºC Package body temperature 260 ºC The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/ JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin (100% Sn). Humidity non-condensing 5 85 % Moisture Sensitivity Level 3 Represents a maximum floor life time of 168h |
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