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GP2W0106YP Datasheet(PDF) 1 Page - Sharp Corporation

Part # GP2W0106YP
Description  115 kbps Transceiver
PDF  16 Pages
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Manufacturer  SHARP [Sharp Corporation]
Direct Link  http://sharp-world.com/
Logo SHARP - Sharp Corporation

GP2W0106YP Datasheet(HTML) 1 Page - Sharp Corporation

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IrDA Data Sheet
1
GP2W0106YP
IrDA Data Sheet
115 kbps Transceiver
FEATURES
• Built-in Photodiode
• Operating voltage 2.0 V to 3.6 V
• Conforms to eye safety IEC60825-1, without exter-
nal resistor
• This product shall not contain the following materi-
als, and these materials shall not be used in the pro-
duction process for this product.
–CFCS
– Halon
– Carbon Tetrachloride
– 1.1.1. Trichloroethane (Methylchloroform)
– Specific brominated flame retardants such as the
PBBOS and PBBS are not used in this device.
INTRODUCTION
This specification applies to the outline and charac-
teristics of IrDA 1.2 type (data rate 2.4 kbps to
115.2 kbps, low power option compliant) optical data
communication transceiver.
NOTES
• Caution should be taken to prevent the detector sur-
face from being smeared with dust or dirt, or from
being touched, as it may cause faulty operation.
• Cleaning conditions:
– Solvent cleaning: Solvent temperature 45°C or
less. Immersion for 3 minutes or less.
– Ultrasonic cleaning: The effect of ultrasonic
cleaning on the device differs by cleaning bath
size, ultrasonic power output, cleaning time, PCB
size or device mounting condition, etc. Test the
device under actual conditions and confirm that
ultrasonic cleaning does not cause any immedi-
ate or potential defects.
– Cleaning solvent: The cleaning shall be carried
out with ethyl alcohol, methyl alcohol, or isopropyl
alcohol.
• In order to prevent electrostatic damage to the inte-
grated circuit, handle this device in a static-free envi-
ronment and workstation.
• External force applied to the device after mounting can
cause mounting defects such as the terminal coming
off. Be careful when handling the device and prevent
objects from touching the device after mounting.
• Refer to the ‘Precautions for Soldering’ section.
• When the system (program) is designed, the turn
around time from transmit to receive should be
designed by considering 200 µs or more that is spec-
ified by IrDA. This turn around time means the time
that this device does not temporarily detect the
incoming signal, since the transmitted light from the
transmitter side reaches the detector side of the
same transceiver.
• Consider that 200 µs or more (at TA = 25°C, no input
signal) is necessary to return from shut-down mode
to ready-operation mode. In addition, thoroughly
confirm the operation in the actual application.
• When there is considerable external stray light or a
light source is located near the transceiver, or the
detector face receives considerable external stray
light, a pulse other than desired signal output may
be generated as noise on output terminal of the
transceiver. Consider the layout and structure in
your design to minimize disturbing light on the
detector face.
• When the sensor is adopted in an IR communication
system, it should be used according to the signal
method which is specified by ‘Serial Infrared Physi-
cal Layer Link Specification’ published by the Infra-
red Data Association. Faulty operation may occur, if
a signal method other than that specified is used.
• RXD pinout is a pullup (260 k
Ω TYP.) to VDD in shut-
down mode. See Table 1 and Figure 2.
• In circuit designs, make allowance for the degradation
of the light emitting diode output that results from
long-term continuous operation (50% degradation/5
years). The light emitting diode output may be
degraded quickly when operated at TA = -40°C, there-
fore it is recommended to operate over TA = -20°C.


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