TESDF5V0A datasheet(4/4 Pages) TSC

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TESDF5V0A

Bi-Directional ESD Protection Array

Small Signal Diode

Tape & Reel specification

Suggested PAD Layout

Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be

within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10

o within the determined cavity.

Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.

Note 3: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts

may vary despending on application.

Reel width

14.4 Max.

Overall tape thickness

Tape width

Dimension (mm)

Carrier depth

0.6 Max.

180 ± 1

50 Min.

13.0 ± 0.5

Item

Symbol

Sprocke hole position

Reel outside diameter

Sprocket hole

Feed hole width

Reel inner diameter

1.22 Max.

1.75 ±0.10

Sprocke hole pitch

1.50 +0.10

4.00 ±0.10

Embossment center

Dimensions

Unit (inch)

Unit (mm)

2.00 ±0.10

8.30 Max.

0.079

0.037

0.035

0.031

2.00

0.95

0.90

0.80

Top Cover Tape

Carieer Tape

Any Additional Label (If Required)

TSC label

Direction of Feed

For Machine Reference Only

Including Draft and RADLL

Concentric Around B0

Top

Cover Tape

See Note1

Center Lines

of Cavity

For Components

2.0mm X 1.2mm

and Larger

10 Pitches Cumulative

Tolerance on Tape

±2.0mm ( ±0.008")

Embossment

Version :

B11

TESDF5V0A Datasheet(PDF) 4 Page - Taiwan Semiconductor Company, Ltd

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