For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

8

8 - 4

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

4. PAD BURR LENGTH SHALL BE 0.15 mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05 mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05 mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.

Part Number

Package Body Material

Lead Finish

MSL Rating

HMC512LP5

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL3

[1]

H512

XXXX

HMC512LP5E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL3

[2]

H512

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

HMC512LP5 / 512LP5E

v05.0811

MMIC VCO w/ HALF FREQUENCY OUTPUT

& DIVIDE-BY-4, 9.6 - 10.8 GHz

Pin Descriptions

Pin Number

Function

Description

Interface Schematic

1 - 3, 8 - 10, 13 - 18,

20, 22 - 28, 30 - 32

N/C

No Connection. These pins may be connected to RF/

DC ground. Performance will not be affected.

4

RFOUT/4

Divide-by-4 output. DC block required.

6

Vcc (Dig)

Supply voltage for prescaler. If prescaler is not

required, this pin may be left open to conserve

approximately 65 mA of current.