Document Number: 89019

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Revision: 19-Apr-11

3

This document is subject to change without notice.

MSS1P3, MSS1P4

Vishay General Semiconductor

New Product

Fig. 5 - Typical Junction Capacitance

Fig. 6 - Typical Transient Thermal Impedance

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

1000

100

10

0.1

1

10

100

Reverse Voltage (V)

1000

100

10

1

0.1

0.01

1

10

100

1000

t - Pulse Duration (s)

Junction to Ambient

0.106 (2.70)

0.091 (2.30)

0.055 (1.40)

0.047 (1.20)

Cathode Band

MicroSMP

0.030 (0.75)

0.022 (0.55)

0.030 (0.75)

0.022 (0.55)

0.059 (1.50)

0.043 (1.10)

0.039 (0.98)

0.031 (0.78)

0.091 (2.30)

0.083 (2.10)

0.020 (0.50)

0.043

(1.10)

0.011 (0.27)

0.005 (0.12)

0.079

(2.00)

0.032

(0.80)

0.032

(0.80)

Mounting Pad Layout

0.029 (0.73)

0.025 (0.63)