IO1

IO2

GND

TPD2E007

SLVS796E – SEPTEMBER 2008 – REVISED AUGUST 2010

www.ti.com

ORDERING INFORMATION

ORDERABLE PART NUMBER

TOP-SIDE MARKING

45

–40°C to 85°C

DSLGA – YFM

Tape and reel

TPD2E007YFMRG4

T

–40°C to 85°C

3-DCK

Tape and reel

TPD2E007DCKR

45U

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

EQUIVALENT SCHEMATIC REPRESENTATION

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

–13.5

13.5

V

YFM package

270

Continuous power dissipation

mW

DCK package

218

Operating temperature range

–40

85

°C

Storage temperature range

–65

150

°C

Junction temperature

150

°C

Infrared (15 s)

220

Bump temperature (soldering)

°C

Vapor phase (60 s)

215

Lead temperature (soldering, 10 s)

300

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the

specifications is not implied. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

Break-down voltage

±14

V

Channel leakage current

20

50

nA

Dynamic resistance

3.5

Ω

Channel input capacitance

10

15

pF

(1)

ESD Protection

PARAMETER

TYP

UNIT

HBM

±15

kV

IEC 61000-4-2 Contact Discharge

±8

kV

IEC 61000-4-2 Air-Gap Discharge

±15

kV

2

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