W25Q32BVZPAP datasheet(9/79 Pages) WINBOND

Part #	W25Q32BVZPAP

Description	3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

PDF	79 Pages

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Manufacturer	WINBOND [Winbond]

Direct Link	http://www.winbond.com

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9 / 79 page

W25Q32BV

Publication Release Date: April 01, 2011

- 9 -

Revision F

3.7 Ball Configuration TFBGA 8x6-mm

Top View

VCC

GND

CLK

/HOLD(IO

DI(IO

DO(IO

/WP (IO

/CS

Figure 1e. W25Q32BV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TC)

3.8 Ball Description TFBGA 8x6-mm

BALL NO.

PIN NAME

I/O

FUNCTION

CLK

Serial Clock Input

GND

Ground

VCC

Power Supply

/CS

Chip Select Input

/WP (IO2)

I/O

Write Protect Input (Data Input Output 2)*

DO (IO1)

I/O

Data Output (Data Input Output 1)*

DI (IO0)

I/O

Data Input (Data Input Output 0)*

/HOLD (IO3)

I/O

Hold Input (Data Input Output 3)*

Multiple

No Connect

*1 IO0 and IO1 are used for Standard and Dual SPI instructions

*2 IO0 – IO3 are used for Quad SPI instructions

W25Q32BVZPAP Datasheet(PDF) 9 Page - Winbond

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