PA3332

Preliminary

CMOS IC

UNISONICTECHNOLOGIESCO.,LTD

2 of 10

www.unisonic.com.tw

QW-R502-488.A

PIN CONFIGURATION

Note: Recommend connecting the Thermal Pad to the GND for excellent power dissipation.

PIN DESCRIPTION

PIN NO.

PIN NAME

DESCRIPTION

1, 12,

13, 24

GND/HS

Ground connection for circuitry, directly connected to thermal pad.

2, 9, 11

NC

Embedded test mode pin, please keep it floating.

3

LOUT+

Left channel + output in BTL mode

4

LIN1

Left channel IN1 input, selected when IN1 /IN2 pin is held low.

5

LIN2

Left channel IN2 input, selected when IN1 /IN2 pin is held high.

6

LBPASS

Connect to voltage divider for left channel internal mid-supply bias.

7

LVDD

Supply voltage input for left channel and for primary bias circuits.

8

SHUTDOWN

Shutdown mode control signal input, places entire IC in shutdown mode when held

10

LOUT-

Left channel - output in BTL mode.

14

MUTE

Mode control signal input, hold low for activation, hold high for mute.

15

ROUT-

Right channel - output in BTL mode

16

IN1/IN2

MUX control input, hold high to select in2 inputs (5,20), hold low to select in1 inputs

(4,21).

17

GND

Ground connection for circuitry.

18

RVDD

Supply voltage input for right channel.

19

RBYPASS

Connect to voltage divider for right channel internal mid-supply bias.

20

RIN2

Right channel in2 input, selected when IN1 /IN2 pin is held high.

21

RIN1

Right channel in1 input, selected when IN1 /IN2 pin is held low.

22

ROUT+

Right channel + output in BTL mode

23

VOL

The output power can be clamped by setting a low bound voltage to this pin. The high

bound voltage will be generated internally. The output voltage will be clamped between

high/low bound voltages. Then the output power is lim-ited. It is weakly pull-low

internally, let this pin floating or tied to GND can deactivate this function.

Thermal

Pad

Recommend connecting the Thermal Pad to the GND for excellent power dissipation.