Data Sheet

SSM2932

Rev. 0 | Page 13 of 16

In addition, good PCB layout isolates critical analog paths from

sources of high interference. High frequency circuits (analog

and digital) should be separated from low frequency circuits.

Properly designed multilayer PCBs can reduce EMI emissions

and increase immunity to the RF field by a factor of 10 or more

compared with double-sided boards. A multilayer board allows

a complete layer to be used for the ground plane, whereas the

ground plane side of a double-sided board is often disrupted by

signal crossover.

If the system has separate analog and digital ground and power

planes, the analog ground plane should be directly beneath the

analog power plane, and, similarly, the digital ground plane should

be directly beneath the digital power plane. There should be no

overlap between analog and digital ground planes or between

analog and digital power planes.