ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

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Suggested Pad Layout

© Diodes Incorporated

U-DFN4030-12 Type C

DFN322

Dimensions

Value

(in mm)

C

0.500

G

0.225

X

0.300

X1

0.800

X2

0.890

X3

0.990

X4

1.150

X5

3.590

Y

0.600

Y1

0.600

Y2

0.440

Y3

1.030

Y4

1.750

Y5

3.400

Y6

0.275

Dimensions

Value

(in mm)

C

0.65

G

0.20

X

0.35

X1

1.52

Y

0.55

Y1

0.98

Y2

0.47

Y3

0.63

Y4

2.20

W-DFN5020-6

W-DFN5060-4

Dimensions Value (in mm)

C

0.50

G

0.35

X

0.35

X1

0.90

X2

1.80

Y

0.70

Y2

1.60

Y3

3.20

Dimensions Value (in mm)

C

4.00

X

0.75

Y

0.95

Y1

6.20

Z

4.75

DF-S / MiniDIP

MSOP-8

Dimensions DF-S

MiniDIP

Z

10.26

6.91

X

1.2

0.60

Y

1.52

0.76

C

5.2

2.67

Dimensions

Value

(in mm)

C

0.650

X

0.450

Y

1.350

Y1

5.300

X3

Y2

Y6

G

1

Y4

Y

Y5

X (12x)

Y3

X4

X5

X1

X2

Y1 (6x)

C

X1

Y3

Y1

Y (2x)

X (3x)

C

C

Y2

Y4

G

Y3

X2

X1

Y2

XC

Y

G

Y1

Y (4x)

X (4x)

C

Z

X

C

Y

Z

X

C

Y

Y1