SPX2815AR datasheet(3/10 Pages) SIPEX

3 / 10 page

Date: 5/17/04

SPX2815 1.5A Low Dropout Voltage Regulator

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 1. Line Regulation for SPX2815U-3.3; I

OUT=10mA

3.300

3.305

3.310

3.315

3.320

3.325

4.5

6.5

8.5

10.5

12.5

14.5

Vin (V)

1.225

1.23

1.235

1.24

1.245

1.25

1.255

1.26

1.265

1.27

1.275

-50

-30

-10

110

130

Temp (C)

1.25v Adj

Figure 2. V

OUT vs Temperature, VIN=2.5V, IOUT=10mA

Figure 3. V

IN=4.0V, IOUT=10mA

2.45

2.46

2.47

2.48

2.49

2.5

2.51

2.52

2.53

2.54

2.55

-50

-30

-10

110

130

Temp (C)

2.5v Adj

2.5v Fixed

Figure 4. V

IN=5.0V, IOUT=10mA

3.26

3.28

3.3

3.32

3.34

3.36

3.38

-50

-30

-10

110

130

Temp (C)

3.3v Adj

3.3v Fixed

Output Capacitor

To ensure the stability of the SPX2815, an

output capacitor of at least 10

µF (ceramic or

tantalum) or 22

µF (aluminum) is required. The

value may change based on the application

requirements of the output load or temperature

range. The value of ESR can vary based on the

type of capacitor used in the applications to

guarantee stability. The recommended value

for ESR is 0.5

Ω or less. A larger value of output

capacitance (up to 100

µF) can improve the load

transient response.

Soldering Methods

The SPX2815 die is attached to the heatsink lead

which exits opposite the input, output, and ground

pins.

Thermal Characteristics

The SPX2815 features the internal thermal lim-

iting to protect the device during overload con-

ditions. Special care needs to be taken during

continuous load conditions such that the maxi-

mum junction temperature does not exceed

125

°C. Thermal protection is activated at >179°C

and deactiviated at <165

°C.

The thermal interaction from other components

in the application can effect the thermal resis-

tance of the SPX2815.

The actual thermal

resistance can be determined with experimenta-

tion.

SPX2815 power dissipation is calculated as

follows:

D = (VIN - VOUT)(IOUT)

Maximum Junction Temperature range:

J = TA(max) + PD* thermal resistance

(junction-to-ambient)

Maximum junction temperature must not ex-

ceed the 125

°C.

APPLICATION INFORMATION

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