AD9518-2ABCPZ datasheet(44/64 Pages) AD

44 / 64 page

AD9518-2

Data Sheet

Rev. C | Page 44 of 64

THERMAL PERFORMANCE

Table 41. Thermal Parameters for the 48-Lead LFCSP

Symbol

Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board

Value (°C/W)

θJA

Junction-to-ambient thermal resistance, natural convection per JEDEC JESD51-2 (still air)

24.7

θJMA

Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)

21.6

θJMA

Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)

19.4

θJB

Junction-to-board thermal resistance, natural convection per JEDEC JESD51-8 (still air)

12.9

ΨJB

Junction-to-board characterization parameter, natural convection per JEDEC JESD51-6 (still air)

and JEDEC JESD51-8

11.9

ΨJB

Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)

and JEDEC JESD51-8

11.8

ΨJB

Junction-to-board characterization parameter, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)

and JEDEC JESD51-8

11.6

θJC

Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD-883, Method 1012.1

1.3

ΨJT

Junction-to-top-of-package characterization parameter, natural convection per JEDEC JESD51-2 (still air)

0.5

ΨJT

Junction-to-top-of-package characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-2 (still air)

0.2

ΨJT

Junction-to-top-of-package characterization parameter, 2.0 m/sec airflow per JEDEC JESD51-2 (still air)

0.3

Use the following equation to determine the junction

temperature of the AD9518 on the application PCB:

TJ = TCASE + (ΨJT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured by the user at the

top center of the package.

ΨJT is the value from Table 41.

PD is the power dissipation of the device (see Table 16).

Values of θJA are provided for package comparison and PCB

design considerations. θJA can be used for a first-order

approximation of TJ by the following equation:

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJC are provided for package comparison and PCB

design considerations when an external heat sink is required.

Values of ΨJB are provided for package comparison and PCB

design considerations.

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