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CLVTH16244AMDGGREP Datasheet(PDF) 2 Page - Texas Instruments

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Part # CLVTH16244AMDGGREP
Description  3.3-V ABT 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS
PDF  15 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CLVTH16244AMDGGREP Datasheet(HTML) 2 Page - Texas Instruments

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GQL OR ZQL PACKAGE
(TOP VIEW)
J
H
G
F
E
D
C
B
A
2
1
3 4
6
5
K
SN74LVTH16244A-EP
3.3-V ABT 16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCAS692F – APRIL 2003 – REVISED APRIL 2007
When VCC is between 0 V and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
abc
TERMINAL ASSIGNMENTS(1)
(56-Ball GQL/ZQL Package)
1
2
3
4
5
6
A
1OE
NC
NC
NC
NC
2OE
B
1Y2
1Y1
GND
GND
1A1
1A2
C
1Y4
1Y3
VCC
VCC
1A3
1A4
D
2Y2
2Y1
GND
GND
2A1
2A2
E
2Y4
2Y3
2A3
2A4
F
3Y1
3Y2
3A2
3A1
G
3Y3
3Y4
GND
GND
3A4
3A3
H
4Y1
4Y2
VCC
VCC
4A2
4A1
J
4Y3
4Y4
GND
GND
4A4
4A3
abc
K
4OE
NC
NC
NC
NC
3OE
abc
abc
(1)
NC - No internal connection
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SSOP – DL
Tape and reel
CLVTH16244AQDLREP
LH16244AEP
–40
°C to 125°C
TSSOP – DGG
Tape and reel
CLVTH16244AQDGGREP
LH16244AEP
TVSOP – DGV
Tape and reel
CLVTH16244AIDGVREP
LL244AEP
–40
°C to 85°C
VFBGA – GQL
CLVTH162244AIGQLREP
Tape and reel
LL244AEP
VFBGA – ZQL (Pb-free)
CLVTH16244AIZQLREP
–55
°C to 125°C TSSOP – DGG
Tape and reel
CLVTH16244AMDGGREP
H16244AMEP
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
2
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